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  • Enclosure for Electronic ComponentsEnclosure for Electronic Components
    Enclosure for Electronic Components
    Project:Enclosure for Electronic Components
    Material:FR-ABS
    Key Challenge:To ensure high-quality production of this housing, the primary challenges involve preventing surface sink marks caused by internal ribs and bosses, managing complex side-action movements for the top openings, and controlling warpage across the large flat surface; these can be resolved by optimizing the rib-to-wall thickness ratio, ensuring high-precision slider fitment, and implementing a balanced cooling and ejection system to maintain dimensional stability and cosmetic integrity.
    Learn More
  • The left and right rear side panels for automobiles.The left and right rear side panels for automobiles.
    The left and right rear side panels for automobiles.
    Project:Automotive Parts
    Material: PP-TD20
    Key Challenge:The main problem encountered is that, due to the large size of the product, it is prone to having insufficient adhesive.
    Our solution was to increase the back pressure to 12, and we also increased the injection position because this injection molding machine is a 2850T. This resulted in more stable
    Learn More
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Gajes Mold Technology Co., Ltd
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