PRODUCTS

Project:Electronic component housing
Material: PC/ABS

Project:Enclosure for Electronic Components
Material:FR-ABS
Key Challenge:To ensure high-quality production of this housing, the primary challenges involve preventing surface sink marks caused by internal ribs and bosses, managing complex side-action movements for the top openings, and controlling warpage across the large flat surface; these can be resolved by optimizing the rib-to-wall thickness ratio, ensuring high-precision slider fitment, and implementing a balanced cooling and ejection system to maintain dimensional stability and cosmetic integrity.