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Enclosure for Electronic Components
Project:Enclosure for Electronic Components
Material:FR-ABS
Key Challenge:To ensure high-quality production of this housing, the primary challenges involve preventing surface sink marks caused by internal ribs and bosses, managing complex side-action movements for the top openings, and controlling warpage across the large flat surface; these can be resolved by optimizing the rib-to-wall thickness ratio, ensuring high-precision slider fitment, and implementing a balanced cooling and ejection system to maintain dimensional stability and cosmetic integrity.
Material:FR-ABS
Key Challenge:To ensure high-quality production of this housing, the primary challenges involve preventing surface sink marks caused by internal ribs and bosses, managing complex side-action movements for the top openings, and controlling warpage across the large flat surface; these can be resolved by optimizing the rib-to-wall thickness ratio, ensuring high-precision slider fitment, and implementing a balanced cooling and ejection system to maintain dimensional stability and cosmetic integrity.
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